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Rework apparatus for electronic parts, rework method, and the heat-insulating cover member for rework equipment

机译:电子零件的返修设备,返修方法以及返修设备的隔热盖部件

摘要

PROBLEM TO BE SOLVED: To provide a rework device of electronic component which makes a wiring board less likely to warp, when reworking an electronic component mounted on a wiring board, and to provide a rework method and a heat insulation cover member for rework device.;SOLUTION: A rework device of electronic component for replacing an electronic component mounted on one side of a wiring board includes a preheater placed in a region on the other side of the wiring board facing the mounting region of a replaced electronic component, and a heat insulation cover member placed on one side of the wiring board and reducing heat dissipation from the outer periphery of the mounting region in one side of the wiring board, when the preheater is preheating.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:提供一种电子零件的返修装置,其在对安装在配线板上的电子零件进行返修时,使配线板不易翘曲,并且提供一种返修方法和该返修装置的隔热盖部件。 ;解决方案:一种用于更换安装在接线板一侧的电子部件的电子部件返修装置,包括预热器,该预热器放置在接线板另一侧的面向更换的电子部件的安装区域的区域中,并带有热量绝缘盖部件放置在接线板的一侧,并在预热器预热时减少接线板一侧安装区域外围的散热。;版权所有:(C)2014,JPO&INPIT

著录项

  • 公开/公告号JP5949296B2

    专利类型

  • 公开/公告日2016-07-06

    原文格式PDF

  • 申请/专利权人 富士通株式会社;

    申请/专利号JP20120173953

  • 发明设计人 福園 健治;佐藤 稔尚;

    申请日2012-08-06

  • 分类号H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-21 14:40:18

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