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Thickness-shear vibration type crystal piece, thickness-shear vibration type crystal piece with the electrode, the crystal vibration plate, crystal oscillator, and crystal oscillator
Thickness-shear vibration type crystal piece, thickness-shear vibration type crystal piece with the electrode, the crystal vibration plate, crystal oscillator, and crystal oscillator
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机译：厚度剪切振动型晶体片，具有电极的厚度剪切振动型晶体片，晶体振动板，晶体振荡器和晶体振荡器
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摘要
PROBLEM TO BE SOLVED: To improve vibration characteristics by achieving compatibility of preventing excessive erosion of etching with securing easiness of separation of a crystal piece part from a crystal substrate to improve shape accuracy of a rectangular crystal piece part (crystal diaphragm) and to improve an oscillation characteristic.;SOLUTION: A thickness-shear vibration type crystal piece M1 manufactured by etching the crystal substrate 11 has the rectangular crystal piece part 1 formed on the crystal substrate 11 by etching, a support frame part 2 for supporting the crystal piece part 1, and a connecting part 3 for separation to connect the crystal piece part 1 with the support frame part 2. The crystal piece part 1 is driven by a thickness-shear mode. The connecting part 3 for separation is disposed in at least one corner part in a Z'-axis direction forming an axis inclined from the Z-axis (optical axis) of a crystal crystalline axis that is the base end part of the crystal piece part 1 on the positive side of the X-axis (electrical axis) of the crystal crystalline axis. Furthermore, the connecting part 3 for separation is formed so as to continuously cover from an outside a virtual side face K1 formed by virtually extending the outside face of the end part in the Z'-axis direction of the crystal piece part 1 in the X-axis direction and a virtual base end face K2 formed by virtually extending the base end face on the positive side of the X-axis of the crystal piece part 1 in the Z'-axis direction.;COPYRIGHT: (C)2013,JPO&INPIT
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