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Glass substrate and the cover glass for an electronic apparatus of the cover glass for an electronic apparatus, and manufacturing method of a glass substrate of the cover glass for an electronic apparatus

机译:电子设备用盖板玻璃的玻璃基板和电子设备用盖板玻璃以及电子设备用盖板玻璃的玻璃基板的制造方法

摘要

The present invention provides a glass substrate of an electronic device cover glass with improved strength of the end face having an apex. glass substrate of the present invention has an end face adjacent the pair of main surfaces, end surfaces has a shape having a top portion when viewed in cross section, has a compressive stress layer by chemical strengthening, the maximum compressive stress value 600MPa or more and a depth of compression stress layer is 60 m or less. Apex angle of the apex [degrees], the maximum compressive stress value CS of surface [MPa], the depth of the compressive stress layer d [ m] is, 600MPa -3.5 (d / sin ( / 2)) satisfy the relationship of -d + CS.
机译:本发明提供一种电子设备用盖板玻璃的玻璃基板,该玻璃基板的具有顶端的端面的强度提高。本发明的玻璃基板的端面与所述一对主面相邻,端面具有在截面观察时具有顶部的形状,具有通过化学强化而产生的压缩应力层,最大压缩应力值为600MPa以上,并且压缩应力层的深度为60m或更小。顶点的顶角[度],表面的最大压应力值CS [MPa],压应力层的深度d [m]为600MPa -3.5(d / sin(/ 2))满足以下关系-d + CS。

著录项

  • 公开/公告号JPWO2014030738A1

    专利类型

  • 公开/公告日2016-08-08

    原文格式PDF

  • 申请/专利权人 HOYA株式会社;

    申请/专利号JP20140531682

  • 发明设计人 高野 徹朗;

    申请日2013-08-23

  • 分类号C03C21;C03C3/083;C03C3/085;C03C3/087;

  • 国家 JP

  • 入库时间 2022-08-21 14:40:35

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