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Silver hybrid copper powder and its preparation, the conductive paste containing silver hybrid copper powder, conductive adhesive, conductive films, and an electrical circuit
Silver hybrid copper powder and its preparation, the conductive paste containing silver hybrid copper powder, conductive adhesive, conductive films, and an electrical circuit
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机译：银杂铜粉及其制备方法，包含银杂铜粉的导电浆料，导电胶，导电膜和电路
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摘要
The present invention, on the surface of the copper powder is deposited silver fine particles, the ratio of the average particle size with an average particle diameter (D50) and the silver particles of copper powder (DSEM) (D50 / DSEM) is 3 to 400 ranges, and silver hybrid copper powder ratio of tap density of copper powder and silver fine particles being in the range of 0.5 to 1.5, their preparation, containing silver hybrid copper powder conductive paste, conductive adhesive, conductive films, and an electrical circuit. Silver hybrid copper powder of the present invention, using copper powder and silver fine particles having a specific average particle diameter and the tap density, deposition of silver fine particles in the copper powder and silver fine powder and the mixture stirred to copper powder particle surfaces It can be obtained by causing conductive, excellent conductivity and migration resistance.
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