A deposition apparatus includes deposition sources (S1, S2, S3, S4), a deposition chamber (CB), a mask assembly (MA, MA10, MA20, MA30), and a transfer unit (TP). The mask assembly (MA, MA10, MA20, MA30) includes a support member (10), a shutter member (20), and a drive member (30). The support member (10) has a first opening (OP1) configured to allow the deposition materials (M1, M2, M3, M4) to pass through while supporting the base substrate (SUB) on which the deposition materials are deposited. The shutter member (20) is accommodated in the support member (10) and has a second opening (OP2) smaller than the first opening (OP1). The drive member (30) is configured to change a position of the second opening (OP2) with respect to the base substrate (SUB) in accordance with the movement of the mask assembly (MA, MA10, MA20, MA30).
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