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A method for structuring and planarization of a layer sequence
A method for structuring and planarization of a layer sequence
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机译：一种层序列的结构化和平面化的方法
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摘要
It is a process for the structuring and planarization of a layer sequence, wherein the method comprises the following steps a to d:In one process step a, a first layer with a first main surface is provided, in a subsequent process step b, a structured mask layer to the first major surface of the first layer is applied, wherein the structured mask layer comprises a dielectric material. In a next process step c, a second layer of a side facing away from the first principal face on the structured mask layer as well as on the first layer is applied, wherein the second layer is a metal layer, and the second layer with the first layer forms a better adhesion than with the structured mask layer and in a process step d, the second layer is removed, wherein the second layer of the structured mask layer is detached and the second layer on the first main face of the first layer remains.
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