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NEW LOW-K FILMS WITH ENHANCED CROSSLINKING BY UV CURING
NEW LOW-K FILMS WITH ENHANCED CROSSLINKING BY UV CURING
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机译：通过紫外线固化增强交联的新型低介电常数薄膜
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摘要
Methods for making a low k porous dielectric film with improved mechanical strength are disclosed herein. A method of forming a dielectric layer can include delivering a deposition gas to a substrate in a processing chamber, the deposition gas comprising an acrylate precursor with a UV active side group and an oxygen containing precursor; activating the deposition gas to deposit an uncured carbon-containing layer on a surface of the substrate; and delivering UV radiation to the uncured carbon-containing layer to create a cured carbon-containing layer, the UV active side group crosslinking with a second group.
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