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AN EDGE-BASED FULL CHIP MASK TOPOGRAPHY MODELING

机译:基于边缘的全芯片面层析成像建模

摘要

A method and apparatus of a novel full chip edge-based mask three-dimensional (3D) model for performing photolithography simulation is described. The method applies a thin mask model to a mask design layout to create a thin mask transmission. The method generates a thick mask model that has a plurality of edge-based kernels. The method applies the thick mask model to the mask design layout to create a mask 3D residual. The method combines the thin mask transmission and the mask 3D residual to create a mask 3D transmission.
机译:描述了用于执行光刻仿真的新颖的基于全芯片边缘的掩模三维(3D)模型的方法和设备。该方法将薄掩模模型应用于掩模设计布局以创建薄掩模透射。该方法生成具有多个基于边缘的内核的厚掩模模型。该方法将厚的蒙版模型应用于蒙版设计布局,以创建蒙版3D残差。该方法将薄掩模透射率和掩模3D残差组合以产生掩模3D透射率。

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