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A TEST STRUCTURE FOR TESTING ELECTRONIC SUB-ASSEMBLIES OF SPACE APPLICATIONS UNDER THERMO VACUUM CONDITIONS
A TEST STRUCTURE FOR TESTING ELECTRONIC SUB-ASSEMBLIES OF SPACE APPLICATIONS UNDER THERMO VACUUM CONDITIONS
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机译：在热真空条件下测试空间应用的电子子组件的测试结构
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摘要
"A test structure for testing electronic sub-assemblies of space applications under thermo-vacuum conditions " The present invention discloses a test structure for testing electronic sub¬assemblies of space applications under thermo-vacuum conditions comprising: a single flange; said single flange provided with D-type shell connectors with plug and socket pins crimped with shortest link on both sides of said flange without adopted harness; multi strand insulated wires of a suitable length are crimped on both sides of plug and socket pins, inspection holes of said pins being sealed with an epoxy adhesive for vacuum sealing and said pins are inserted in the outer side and inner side of said connector shell being mounted flush onto the said flange; and said flange also provided with D-type coaxial contacts crimped on both sides of said flange without adopter harnesses. Fig 2b
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