首页> 外国专利> Compact low-flare solid-state imaging apparatus and electronic system comprising a compact low-flare solid-state imaging apparatus

Compact low-flare solid-state imaging apparatus and electronic system comprising a compact low-flare solid-state imaging apparatus

机译:紧凑型低耀斑固态成像设备和包括紧凑型低耀斑固态成像设备的电子系统

摘要

A solid-state imaging apparatus includes: a solid-state imaging device mounted on a substrate; a bonding wire that electrically connects a pad formed on the solid-state imaging device to a lead island formed on the substrate; a frame member that has a frame-like shape and surrounds side portions of the solid-state imaging device; and a light-transmissive optical member so accommodated in the frame member that the optical member faces an imaging surface of the solid-state imaging device, wherein the frame member has a leg portion extending from the side where the optical member is present toward the imaging surface, and the frame member is integrally fixed to the solid-state imaging device with an end of the bonding wire that is connected to the pad covered with the leg portion.
机译:一种固态成像装置,包括:固态成像装置,其安装在基板上;以及键合线将形成在固态成像装置上的焊盘电连接到形成在基板上的引线岛。具有框状形状并且围绕固态成像装置的侧部的框架构件;透光光学部件被容纳在框架部件中以使光学部件面对固态成像装置的成像表面,其中框架部件具有从存在光学部件的一侧朝向成像方向延伸的腿部。框架部件被一体地固定在固态成像装置上,并且键合线的一端连接到被脚部覆盖的焊盘。

著录项

  • 公开/公告号US9025079B2

    专利类型

  • 公开/公告日2015-05-05

    原文格式PDF

  • 申请/专利权人 YASUHIRO KAMADA;

    申请/专利号US201213422915

  • 发明设计人 YASUHIRO KAMADA;

    申请日2012-03-16

  • 分类号H04N5/225;H01L27/146;

  • 国家 US

  • 入库时间 2022-08-21 15:17:13

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