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METHOD OF DETECTING FAULTS OF OPERATION ALGORITHMS IN A WIRE BONDING MACHINE AND APPARATUS FOR PERFORMING THE SAME

机译:接线机中操作算法故障的检测方法及执行该方法的装置

摘要

In a method of detecting faults of operation algorithms in a wire bonding machine, individual bond parameters with respect to each of the operation algorithms of the wire bonding machine can be set based on design data including information with respect to conductive wires connected between semiconductor chips of a semiconductor package. Actual conductive wires of an actual semiconductor package can be formed using the wire bonding machine into which the design data can be inputted. Actual data with respect to actual operation algorithms of the wire bonding machine, which can form the actual conductive wires, can be obtained. The actual data can be compared with the individual bond parameters to detect the faults of the operation algorithms of the wire bonding machine. Thus, forming an abnormal conductive wire by the wire bonding machine can be prevented beforehand.
机译:在检测引线键合机中的操作算法的故障的方法中,可以基于设计数据来设置与引线键合机的每个操作算法有关的各个键合参数,所述设计数据包括关于连接在半导体芯片之间的导线的信息。半导体封装。可以使用可以将设计数据输入到其中的引线键合机来形成实际半导体封装的实际导线。可以获得关于可以形成实际导线的引线键合机的实际操作算法的实际数据。可以将实际数据与各个键合参数进行比较,以检测引线键合机操作算法的故障。因此,可以预先防止通过引线键合机形成异常的导线。

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