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Silicon oxynitride film formation method and substrate equipped with silicon oxynitride film formed thereby

机译:氧氮化硅膜的形成方法以及具备该氧氮化硅膜的基板

摘要

The present invention provides a silicon oxynitride film formation method capable of reducing energy cost, and also provides a substrate equipped with a silicon oxynitride film formed thereby. This method comprises the steps of: casting a film-formable coating composition containing a polysilazane compound on a substrate surface to form a coat; drying the coat to remove excess of the solvent therein; and then irradiating the dried coat with UV light at a temperature lower than 150° C.
机译:本发明提供了一种能够降低能量成本的氮氧化硅膜形成方法,并且还提供了一种配备有由此形成的氮氧化硅膜的基板。该方法包括以下步骤:在基材表面上流延包含聚硅氮烷化合物的可成膜涂料组合物以形成涂层;干燥涂层以除去其中的过量溶剂;然后在低于150℃的温度下用UV光照射干燥的涂层。

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