Apparatus and Method for Removing Challenging Polymer Films and Structures from Semiconductor Wafers

• 1. 用于在沉积室中生产具有外延层的半导体晶片的方法、用于生产具有外延层的半导体晶片的设备和具有外延层的半导体晶片 [P] . 中国专利： CN108474135A . 2018-08-31
• 2. 于半导体晶片上形成金属凸块的方法及具有如此形成的金属凸块的半导体晶片装置 [P] . 中国专利： CN1665008A . 2005-09-07
• 3. Apparatus and method for removing challenging polymer films and structures from semiconductor wafers [P] . 美国专利： US9541837B2 . 2017-01-10

  机译： 用于从半导体晶片上去除具有挑战性的聚合物膜和结构的设备和方法

• 4. APPARATUS AND METHOD FOR REMOVING CONTACT HOLE SURFACE PROTECTIVE FILM OF SEMICONDUCTOR SILICON WAFER AND BURYING FILM INTO CONTACT HOLE OF SEMICONDUCTOR SILICON WAFER [P] . 世界知识产权组织专利： WO2011018831A1 . 2011-02-17

  机译： 去除半导体硅晶片的接触孔保护膜并将膜埋入半导体硅晶片的接触孔的装置和方法

• 5. Process for semiconductor apparatus including forming an insulator and a semiconductor film on the backside of the wafer and removing the semiconductor film from the backside [P] . 美国专利： US6861359B2 . 2005-03-01

  机译： 半导体装置的工艺包括在晶片的背面上形成绝缘体和半导体膜并从背面去除半导体膜

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