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ENGINEERED SUBSTRATES HAVING MECHANICALLY WEAK STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS

机译:具有机械弱结构和相关系统和方法的工程化基体

摘要

Engineered substrates having mechanically weak structures for separating substrates from epitaxially grown semiconductor structures and associated systems and methods are disclosed herein. In several embodiments, for example, an engineered substrate can be manufactured by forming an intermediary material at an upper surface of a structural material and forming a plurality of pores in the intermediary material. The porous intermediary material and the structural material can define a handle substrate. The method can further include bonding an epitaxial formation structure on the handle substrate such that the porous intermediary material is between the epitaxial formation structure and the structural material. In various embodiments, the porous intermediary material is configured to break under mechanical stress.
机译:本文公开了具有用于从外延生长的半导体结构中分离衬底的机械弱结构的工程衬底以及相关的系统和方法。在一些实施例中,例如,可以通过在结构材料的上表面形成中间材料并在中间材料中形成多个孔来制造工程衬底。多孔中间材料和结构材料可以限定手柄基板。该方法可以进一步包括在处理衬底上粘合外延形成结构,使得多孔中间材料在外延形成结构和结构材料之间。在各种实施例中,多孔中间材料被配置为在机械应力下破裂。

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