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Production of semiconductor integrated circuit device using the grain size and grain size distribution evaluation method as well as that of the metal layer How
Production of semiconductor integrated circuit device using the grain size and grain size distribution evaluation method as well as that of the metal layer How
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机译：使用晶粒尺寸和晶粒尺寸分布评估方法以及金属层的制造方法生产半导体集成电路器件
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摘要
PROBLEM TO BE SOLVED: To achieve a method of evaluating a crystal particle size and a particle size distribution in a metal layer nondestructively and online.SOLUTION: The method includes: a step A of acquiring a diffraction peak obtained by X-ray irradiation to a metal layer which has a crystalline texture and has the diffraction peak in a specific orientation with respect to X rays; a step B of obtaining an area average column length and a volume average column length on the basis of the diffraction peak; and a step C of obtaining a logarithmic normal distribution of a crystal particle size from the area average column length and the volume average column length.
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