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CERAMIC WIRING BOARD, CERAMIC GREEN SHEET FOR CERAMIC WIRING BOARD, AND GLASS CERAMIC POWDER FOR CERAMIC WIRING BOARD
CERAMIC WIRING BOARD, CERAMIC GREEN SHEET FOR CERAMIC WIRING BOARD, AND GLASS CERAMIC POWDER FOR CERAMIC WIRING BOARD
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机译：陶瓷接线板，用于陶瓷接线板的陶瓷绿板和用于陶瓷接线板的玻璃陶瓷粉
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摘要
PROBLEM TO BE SOLVED: To provide a ceramic wiring board high in mechanical strength, which can be baked at a low temperature, and of which the thermal expansion coefficient can be controlled to become low.SOLUTION: A ceramic wiring board 1 comprises a ceramic substrate 10 and an internal conductor 20. The internal conductor 20 is provided inside the ceramic substrate 10 as a form of wiring. The ceramic substrate 10 includes glass, a first ceramic filler and a second ceramic filler. The first ceramic filler is lower than the second ceramic filler in thermal expansion coefficient in a temperature range of -40 to +125°C. The second ceramic filler is higher than the first ceramic filler in three-point-bending strength.
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