首页> 外国专利> Apparatus for cooling power-electronic device e.g. frequency converter, has heat sink that is provided with specific cooling surface larger than preset cooling surface, coupled directly with electronic device through another heat sink

Apparatus for cooling power-electronic device e.g. frequency converter, has heat sink that is provided with specific cooling surface larger than preset cooling surface, coupled directly with electronic device through another heat sink

机译：用于冷却电力电子设备的设备，例如变频器，具有散热片，该散热片具有比预设的散热表面大的特定冷却表面，并通过另一个散热片与电子设备直接耦合

页面导航

摘要
著录项
相似文献

摘要

The apparatus has cooling units (1-4) that are provided with a cavity of which a cooling medium can flow through. One side of the cooling unit is provided with a preset cooling surface. A heat sink (8) is directly mounted on preset cooling surface. The material the main component of the heat sink is different than the material of the main component of the cooling unit. The heat sink is provided with a specific cooling surface (9) coupled directly with a power-electronic device (6,7) through another heat sink. The specific cooling surface is larger than the preset cooling surface.

机译：该设备具有冷却单元（1-4），该冷却单元设有腔室，冷却介质可以流过该腔室。冷却单元的一侧设置有预设的冷却表面。散热器（8）直接安装在预设的冷却表面上。散热器主要部件的材料与冷却单元主要部件的材料不同。散热器设置有特定的冷却表面（9），该特定的冷却表面通过另一个散热器与功率电子设备（6,7）直接耦合。特定的冷却表面大于预设的冷却表面。

著录项

公开/公告号DE102013201622A1

专利类型
公开/公告日2014-07-31

原文格式PDF
申请/专利权人 SIEMENS AKTIENGESELLSCHAFT;
展开▼

申请/专利号DE201310201622
发明设计人 HOFFMANN INGOLF;HUBER NORBERT;IPPISCH STEPHAN;
展开▼

申请日2013-01-31
分类号H05K7/20;H01L23/473;H02B1/56;F28F21/08;
国家 DE
入库时间 2022-08-21 15:37:18

相似文献

专利
外文文献
中文文献