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STATIC PRESSURE PAD FOR DOUBLE SIDE GRINDING MACHINE FOR SEMICONDUCTOR WAFER, DOUBLE SIDE GRINDING MACHINE COMPRISING SUCH STATIC PRESSURE PAD, AND DOUBLE SIDE GRINDING METHOD USING SUCH STATIC PRESSURE PAD
STATIC PRESSURE PAD FOR DOUBLE SIDE GRINDING MACHINE FOR SEMICONDUCTOR WAFER, DOUBLE SIDE GRINDING MACHINE COMPRISING SUCH STATIC PRESSURE PAD, AND DOUBLE SIDE GRINDING METHOD USING SUCH STATIC PRESSURE PAD
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机译：半导体晶片双侧磨床的静压垫，具有这种静压垫的双侧磨床以及使用这种静压垫的双侧磨削方法
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摘要
The present invention is a double disc grinding apparatus of the semiconductor wafer, the static pressure of the fluid supplied to the both surfaces of the raw material wafer As a non-contact support of the pad at both sides of the positive pressure by the source wafer, the pattern of protrusions of a land surrounding a pocket formed on the surface of the side that supports the raw wafer of the static pressure pad, the outer periphery are necessary to support the raw wafer and the land pattern is concentric with respect to the rotation center of the raw wafer, and the land pattern on the inner side of the outer circumferential land pattern is a non-concentric with respect to the rotation center of the raw wafer, and all the straight lines which bisect the static pressure pad wherein a static pressure pad, characterized in that the asymmetric with respect to. ; Thus, the double disc grinding of the wafer after the nano-topography of a semiconductor wafer to minimize the "middle ring" of the average, and the average component double disc grinding machine and double disc grinding method is provided.
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