首页> 外国专利> Probe array integrated component defect inspection method and induced by operation of said probe array currents.

Probe array integrated component defect inspection method and induced by operation of said probe array currents.

机译:探针阵列集成部件缺陷检查方法并由所述探针阵列电流的操作引起。

摘要

a probe array comprising at least one sensor array (2), with a set of individual sensors (S) formed in layers (Ci) of a substrate arranged multilayer (SCn) and aligned in at least two rows is provided ( 3, 4), these sensors being adapted to switch between a transmitting state and a receiving state via a respective multiplexer unit transmitter / receiver (TX MUX, MUX RX) governed by a control circuit (CTRL). The probe comprises a first flexible portion (5), essentially laminar, bearing the sensor array (2) and a first rigid portion (6), also essentially laminar, integrating multiplexers blocks, the control circuit and an amplifier device ( AMP) to raise the level of signal from the receiver multiplexer unit (MUX RX); and said flexible and rigid part said being joined to form a single circuit assembly rigiflex type.
机译:提供包括至少一个传感器阵列(2)的探针阵列,其中一组单独的传感器(S)形成在布置成多层(SCn)的基板的层(Ci)中并且至少成两行对准(3、4)这些传感器适于通过由控制电路(CTRL)控制的各个多路复用器单元的发送器/接收器(TX MUX,MUX RX)在发射状态和接收状态之间切换。探针包括承载传感器阵列(2)的基本上为层状的第一柔性部分(5)和也为基本为层状的第一刚性部分(6),集成了多路复用器模块,控制电路和放大的放大器设备(AMP)来自接收器多路复用器单元(MUX RX)的信号电平;所述柔性和刚性部件被接合以形成单电路组件rigiflex型。

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