首页> 外国专利> METHOD FOR INTEGRATION OF A COMPONENT IN A CIRCUIT BOARD AND CIRCUIT BOARDS AND INTERMEDIATE PCB OR LEITERPLATTEN INTERMEDIATE

METHOD FOR INTEGRATION OF A COMPONENT IN A CIRCUIT BOARD AND CIRCUIT BOARDS AND INTERMEDIATE PCB OR LEITERPLATTEN INTERMEDIATE

机译:在电路板和电路板以及中间PCB或拼板中间件中集成组件的方法

摘要

In a method for integrating a component in a circuit board or PCB intermediate following steps: - providing a layer (1) for at least temporary support of to be integrated component (4), - setting the to-integrate component (4) on the supporting layer (1), - providing a printed circuit board element (9) with a recess (10), which dimensions, at least according to the size and shape of the integrated component (4), - setting the printed circuit board element (9) to the supporting layer (1 ), said to be integrated component (4) is received in the recess (10), said recess (10) for receiving the material to be integrated component (4) having printed circuit board element (9) of at least one non-conducting layer of the produced printed circuit board formed or fabricated PCB intermediate wird.Darüber addition, a printed circuit board or PCB intermediate is provided.
机译:在用于将部件集成到电路板或PCB中间的方法中,包括以下步骤:-提供层(1),以至少临时支撑要集成的部件(4),-将待集成的部件(4)放置在电路板上。支撑层(1),-提供带有凹槽(10)的印刷电路板元件(9),其尺寸至少根据集成组件(4)的尺寸和形状确定,-设置印刷电路板元件(如图9所示,在支撑层(1)上,所述被集成部件(4)被容纳在凹部(10)中,所述凹部(10)用于容纳待集成部件(4)的材料具有印刷电路板元件(9) )至少一个不导电层,该至少一个不导电层是所形成或制造的印刷电路板中间体或多层印刷电路板。达吕伯(Darüber)此外,还提供了印刷电路板或印刷电路板中间体。

著录项

  • 公开/公告号AT13432U1

    专利类型

  • 公开/公告日2013-12-15

    原文格式PDF

  • 申请/专利号AT20110000481U

  • 发明设计人

    申请日2011-08-31

  • 分类号H05K1/18;H05K3/46;

  • 国家 AT

  • 入库时间 2022-08-21 15:55:32

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