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The method for producing the heat conduction structure of N LED includes: one D conductive rod and one end of the heat conductive rod (7) on the side of the third polychlorinated biphenyl and the length of the top of the heat conductive rod greater than or equal to the length of the third polychlorinated biphenyl. Smell.
The method for producing the heat conduction structure of N LED includes: one D conductive rod and one end of the heat conductive rod (7) on the side of the third polychlorinated biphenyl and the length of the top of the heat conductive rod greater than or equal to the length of the third polychlorinated biphenyl. Smell.
A manufacturing process of a high-power LED radiating structure includes steps of: (1) preparing parts or material such as a PCB board (4), a heat conducting plate (6) and a heat dissipating plate (9); (2) providing a first locating hole and a first fixing hole passing through the PCB board, welding a copper plate layer on one side of the PCB board, and welding an electrode weld pad on the other side of the PCB board, and then applying soldering paste on the surface of the copper plate layer; (3) providing a second locating hole and a second fixing hole passing through the heat conducting plate; (4) inserting a fixing pole into the first and second fixing holes to fixedly connect the PCB board and the heat conducting plate together; (5) inserting the heat conducting pole into the first and second locating holes; (6) proving the heat conducting plate and the PCB board resulted from step (5) on a stamping equipment, and adjusting the length of the protruding end of the heat conducting pole. The inventive process is simple, and the manufactured dissipating structure is advantageous for a simple construction and good heat conducting and dissipating effects.
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