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Method of manufacturing a printed circuit board, a wiring circuit board assembly sheet manufacturing method, the wiring circuit board and the wiring circuit board assembly sheet
Method of manufacturing a printed circuit board, a wiring circuit board assembly sheet manufacturing method, the wiring circuit board and the wiring circuit board assembly sheet
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机译：制造印刷电路板的方法，布线电路板组件片的制造方法，布线电路板和布线电路板组件片
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摘要
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring circuit board, along with a method of manufacturing a wiring circuit board assembly sheet, a wiring circuit board, and a wiring circuit board assembly sheet, capable of accurately and easily discriminating quality of a wiring circuit substrate part.;SOLUTION: A suspension substrate 1 and a base insulating layer for a holding piece Q are formed on a conductive support substrate. By etching the support substrate, the support substrate of the suspension substrate 1 and a plurality of conductive parts p1-p5 are formed. The holding piece Q and the conductive parts p1-p5 constitute a form determination part 2. The conductive parts p3 and p4 are arranged to be separated from each other, and the conductive part p5 is formed between the conductive parts p3 and p4. At one end and the other end of the conductive part p5, the conductive parts p1 and p2 are formed integrally with the conductive part p5. Whether or not two conductive parts p1 and p2 of the shape determination part 2 are conductive from each other is determined, and whether or not two conductive parts p1 and p3 are conductive to each other is determined.;COPYRIGHT: (C)2012,JPO&INPIT
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