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Individual support device for use in component system for supporting e.g. electronic chips in photonic applications, has aspiration pipe emerging in cavity to make component placed in cavity to have rear face in depression
Individual support device for use in component system for supporting e.g. electronic chips in photonic applications, has aspiration pipe emerging in cavity to make component placed in cavity to have rear face in depression
The device has a receiving plate (1) equipped with a set of cavities, where each cavity is adapted to receive a component (20) by a rear face (22) of the component. An aspiration pipe (13) is provided in the cavity, and emerges in a base wall of the cavity so as to make the component placed in the cavity to have the rear face in depression relative to a front face (21) of the component. The front face is opposed to the rear face. An aspiration circuit is formed in the receiving plate, and includes a connection opening (12). An independent claim is also included for a method for transferring components.
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