首页> 外国专利> Individual support device for use in component system for supporting e.g. electronic chips in photonic applications, has aspiration pipe emerging in cavity to make component placed in cavity to have rear face in depression

Individual support device for use in component system for supporting e.g. electronic chips in photonic applications, has aspiration pipe emerging in cavity to make component placed in cavity to have rear face in depression

机译:用于组件系统中的单个支撑设备,用于支撑例如光子应用中的电子芯片,空腔中有吸气管,使元件放置在空腔中,使背面凹陷

摘要

The device has a receiving plate (1) equipped with a set of cavities, where each cavity is adapted to receive a component (20) by a rear face (22) of the component. An aspiration pipe (13) is provided in the cavity, and emerges in a base wall of the cavity so as to make the component placed in the cavity to have the rear face in depression relative to a front face (21) of the component. The front face is opposed to the rear face. An aspiration circuit is formed in the receiving plate, and includes a connection opening (12). An independent claim is also included for a method for transferring components.
机译:该装置具有配备有一组腔体的接收板(1),其中每个腔体适于通过部件的背面(22)接收部件(20)。抽吸管(13)设置在腔体中,并出现在腔体的底壁中,以使放置在腔体中的部件的背面相对于部件的正面(21)凹陷。正面与背面相对。抽吸回路形成在接收板中,并且包括连接开口(12)。还包括一种用于转移组件的方法的独立权利要求。

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