首页> 外国专利> A method for leveling of disbursal materials, as well as for leveling mechanism

A method for leveling of disbursal materials, as well as for leveling mechanism

机译:分配材料校平的方法以及校平机制

摘要

The invention relates to a method for leveling of disbursal materials utilized mechanism, wherein the mechanism of a gangway are accessible, wherein that a leveling device (1) on a vehicle continuously along the gangway method, wherein the leveling device (1) perpendicular to the gangway extends into the mechanism and there, the disbursal materials, evens.Furthermore, the invention relates to a leveling device (1) in a coop for mechanism in particular for carrying out the method stated in claim 1, wherein the bottom of the mechanism is covered with disbursal materials, in the operating position about a substantially horizontally oriented axis (x) rotatable worm shaft (2) with a circumferential screw, wherein the worm shaft (2) of a motor (3) is designed to be driven in rotation in the working position and to the farthest into the head end 16 of the pointing mechanism (20) of the screw shaft (2) a tapering screw portion (22) is arranged.
机译:本发明涉及一种用于利用支出材料的校平方法的机构,其中,通道的机构是可接近的,其中,车辆上的校平装置(1)沿着通道的方法连续地进行,其中,校平装置(1)垂直于通道。此外,本发明涉及一种用于机构的盖的校平装置(1),特别是用于执行权利要求1中所述的方法,其中,该机构的底部是在工作位置上,由覆盖有支付材料的蜗杆围绕着一个基本上水平定向的轴(x),该蜗杆轴(2)带有一个圆周螺钉,其中,电机(3)的蜗杆轴(2)被设计为可旋转地驱动在工作位置并且最远到丝杠轴(2)的定点机构(20)的头端16处,设置了锥形的螺丝部分(22)。

著录项

  • 公开/公告号DE102012105155A1

    专利类型

  • 公开/公告日2012-12-20

    原文格式PDF

  • 申请/专利权人 D. MEHRTENS MASCHINENTECHNIK GMBH;

    申请/专利号DE201210105155

  • 发明设计人 DETLEV DIPL.-ING. MEHRTENS;

    申请日2012-06-14

  • 分类号A01K1/015;

  • 国家 DE

  • 入库时间 2022-08-21 16:21:49

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