首页>
外国专利>
Power half conductor module system and power semiconductor module with a housing and process for the production of the inside of the conductor arrangement - leis device
Power half conductor module system and power semiconductor module with a housing and process for the production of the inside of the conductor arrangement - leis device
展开▼
机译：带有壳体的功率半导体模块系统和功率半导体模块以及制造导体装置内部的方法-LEIS设备
展开▼
页面导航
摘要
著录项
相似文献
摘要
Power semiconductor module system comprising conductors:a housing (10), the an inner housing (12), which comprises a cover (14) and has an edge zone (15);an electrically insulating substrate (30), an electrically insulating body (33) with a first primary surface (31) and a second primary surface (32) comprises;at least one of the first primary surface (31) of the electrically insulating substrate (30) which are mounted in a power semiconductor component (34 conductor);at least one, in addition to a side surface (20) of the edge zone (15) which is arranged in the pressure element (13), wherein the pressure element (13) with the inner housing (12) by means of elastic coupling strip (21) is coupled elastically, wherein the pressure element (13), the inner housing (12) and the elastic coupling strip (21) are components of a single plastic part;a printing plate (40); anda fastening means (38);the printing plate (40) on an upper surface (26) of the pressure element (13) and arranged with the fastening means (38) to a further surface (43) can be fastened, that the printing plate (40) by means of the fastening means (38) a force on the pressure element (13), so that the housing (10) and the electrically insulating substrate (30) on the further surface (43) are mounted.
展开▼
