首页> 外国专利> A method for producing a compound semiconductor material, a III-N layer or a III-N bulk crystal, a reactor for producing the compound semiconductor material, compound semiconductor material, III-N bulk crystal and III-N crystal layer

A method for producing a compound semiconductor material, a III-N layer or a III-N bulk crystal, a reactor for producing the compound semiconductor material, compound semiconductor material, III-N bulk crystal and III-N crystal layer

机译:用于制造化合物半导体材料,III-N层或III-N块状晶体的方法,用于制造化合物半导体材料的反应器,化合物半导体材料,III-N块状晶体和III-N晶体层

摘要

A process for producing a compound semiconductor material by vapor phase epitaxy in a reactor comprising a flow profile represented by local mass flow rates in a mixture of carrier gases capable of carrying one or more reaction gases towards a substrate (7, 16) A reactor is formed, characterized in that a predetermined value for the concentration of hydrogen at the surface of the substrate (7, 16) is achieved by adjusting a volume flow rate of hydrogen as a first carrier gas in the mixture, and the resulting influence on the flow profile in the reactor (10, 20) is compensated by adjusting the respective volumetric flow rates of a second and a third carrier gas in the mixture to obtain a predetermined, independent of the hydrogen concentration flow profile.
机译:一种在反应器中通过气相外延生产化合物半导体材料的方法,该方法包括以载气的混合物中的局部质量流率表示的流量分布,该载气的混合物能够将一种或多种反应气体流向基板(7、16)。形成的特征在于,通过调节混合物中作为第一载气的氢气的体积流量及其对流量的影响,来获得基板(7、16)表面上氢气浓度的预定值。通过调节混合物中第二和第三载气的各自体积流速来补偿反应器(10、20)中的流速分布,以获得与氢浓度流速分布无关的预定值。

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