• 主题
高级搜索  >
历史搜索 清空历史
首页> 外国专利> METHOD OF FORMING 3D MICROSTRUCTURES OF ENGRAVING PATTER IN FUNCTIONAL LAYER OF INTAGLIO PRINTING DIE FUNCTIONAL LAYER AT COMPUTER-AIDED ENGRAVING HARDWARE-SOFTWARE COMPLEX

METHOD OF FORMING 3D MICROSTRUCTURES OF ENGRAVING PATTER IN FUNCTIONAL LAYER OF INTAGLIO PRINTING DIE FUNCTIONAL LAYER AT COMPUTER-AIDED ENGRAVING HARDWARE-SOFTWARE COMPLEX

机译：在计算机辅助雕刻硬件软件复杂的凹版印刷模具功能层功能层中形成图案的3D微观结构的形成方法

页面导航
  • 摘要
  • 著录项
  • 相似文献

摘要

FIELD: process engineering.;SUBSTANCE: proposed method comprises two stages of machining, at least, one 3D microstructure by cutting to remove functional layer material with the help of polyhedral, primarily, trihedral pyramidal cutting tool, every side of which making tool front surface. To up the precision, roughing is performed by high-speed milling to remove main part of functional layer material in said microstructure and provide for allowance for finishing. Said finishing is made in one pass along the microstructure contour by planning at second stage. Note here that first and second stages are performed by aforesaid one tool.;EFFECT: higher precision.;3 dwg
机译：领域：所提出的方法包括两个阶段的加工，至少是一个3D显微组织，该过程是借助多面体（主要是三面角锥体切削刀具）切削以去除功能层材料而实现的，每个侧面都使刀具前表面。为了提高精度，通过高速铣削进行粗加工以去除所述微结构中的功能层材料的主要部分并提供精加工余量。通过在第二阶段进行规划，沿着微结构轮廓进行一次加工。注意这里的第一和第二阶段是通过上述一个工具执行的;效果：更高的精度; 3 dwg

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号