METHOD FOR PREPARING A COMPLEX SUBSTRATE FILM AND BACKGRINDING TAPE FOR SEMICONDUCTOR WAFER COMPRISING A COMPLEX SUBSTRATE FILM PREPARED BY THE SAME

• 1. 一种复合衬底的制备方法、复合衬底及复合薄膜 [P] . 中国专利： CN112701033A . 2021-04-23
• 2. 波导结构复合衬底的制备方法、复合衬底及光电晶体薄膜 [P] . 中国专利： CN112379480A . 2021-02-19
• 3. Method for preparing a complex substrate film and backgrinding tape for semiconductor wafer comprising a complex substrate film prepared by the same [P] . 韩国专利： KR101386914B1 . 2014-04-18

  机译： 制备复合衬底膜的方法和用于半导体晶片的背面研磨带，包括由其制备的复合衬底膜

• 4. SURFACE-PROTECTION TAPE FOR SEMICONDUCTOR WAFERS FOR USE DURING BACKGRINDING PROCESS AND SUBSTRATE FILM FOR THE SURFACE-PROTECTION TAPE [P] . 韩国专利： KR101494682B1 . 2015-02-23

  机译： 背衬加工过程中使用的半导体晶片的表面保护胶带和基材膜

• 5. SURFACE-PROTECTION TAPE FOR SEMICONDUCTOR WAFERS FOR USE DURING BACKGRINDING PROCESS AND SUBSTRATE FILM FOR THE SURFACE-PROTECTION TAPE [P] . MY153422A . 2015-02-13

  机译： 背衬加工过程中使用的半导体晶片的表面保护胶带和基材膜

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