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WAFER LEVEL PROTECTION STRUCTURE OF A MICRO DEVICE, THE MICRO DEVICE INCLUDING THE SAME, AND MANUFACTURING METHODS THEREOF CAPABLE OF IMPLEMENTING NORMAL PACKAGING BY REFLECTING THE INFLUENCE OF THE WARPAGE OF A WAFER
WAFER LEVEL PROTECTION STRUCTURE OF A MICRO DEVICE, THE MICRO DEVICE INCLUDING THE SAME, AND MANUFACTURING METHODS THEREOF CAPABLE OF IMPLEMENTING NORMAL PACKAGING BY REFLECTING THE INFLUENCE OF THE WARPAGE OF A WAFER
PURPOSE: A wafer level protection structure of a micro device, the micro device including the same, and manufacturing methods thereof are provided to efficiently protect a driving part of the micro device by installing a wafer level protection structure in a contact part with the driving part of the micro device.;CONSTITUTION: An elastic spacer(32A) is formed on a first surface of a substrate(30). The elastic spacer is made of a silicon resin. The silicon resin is one of PMDS(Polydimethylsiloxane), PMPS(Polymethylphenylsiloxane), and PVS(Polyvinylsiloxane). A adhesion preventing layer(34) is formed on the first surface inside the spacer and is one of a metal layer, an oxide layer, and a nitride layer. The oxide layer includes one of Al2O3, TiO2, Cr2O3, Ta2O3, and LTO.;COPYRIGHT KIPO 2013
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