INTERMETALLIC M-Sn₅ (M=Fe, Cu, Co, Ni) COMPOUND AND A METHOD OF SYNTHESIS THEREOF

• 1. Ni(Fe)－Al系金属间化合物涂层制备方法 [P] . 中国专利： CN100351421C . 2007.11.28
• 2. Ni(Fe)－Al系金属间化合物涂层制备方法 [P] . 中国专利： CN1641061A . 2005-07-20
• 3. Intermetallic M—Sn₅ (M=Fe, Cu, Co, Ni) compound and a method of synthesis thereof [P] . 美国专利： US9755229B2 . 2017-09-05

  机译： 金属间化合物M-Sn _{5 （M = Fe，Cu，Co，Ni）化合物及其合成方法}

• 4. INTERMETALLIC M-Sn5 (M=Fe, Cu, Co, Ni) COMPOUND AND A METHOD OF SYNTHESIS THEREOF [P] . 美国专利： US2015004490A1 . 2015-01-01

  机译： 间金属M-Sn5（M = Fe，Cu，Co，Ni）化合物及其合成方法

• 5. SURFACE TREATMENT METHOD FOR DUAL MULTI-PHASE Ni BASED INTERMETALLIC COMPOUND ALLOY, AND SURFACE-TREATED DUAL MULTI-PHASE Ni BASED INTERMETALLIC COMPOUND ALLOY [P] . 日本专利： JP2009197254A . 2009-09-03

  机译： 双相多相镍基金属间化合物合金的表面处理方法以及双相多相镍基金属间化合物的表面处理

• 1. Surface Properties of Cu Doped La-Ni Intermetallic Compounds [J] . Baisheva R.G., Ibgasheva R.Kh. 高等学校化学研究：英文版 . 1993,第003期
• 2. Preparing Fe5C2 Intermetallic Compound by Mechanical Alloying Method at Room Temperature and Normal Pressure [J] . 何正明, 钟敏建, 沈伟星, 上海大学学报：英文版 . 2003,第001期
• 3. Effect of Cross-Interaction between Ni and Cu on Growth Kinetics of Intermetallic Compounds in Ni/Sn/Cu Diffusion Couples during Aging [J] . K.K. HONG, J.B. RYU, C.Y. PARK, Journal of Electronic Materials . 2008,第1期
• 4. Effect of Cross-Interaction between Ni and Cu on Growth Kinetics of Intermetallic Compounds in Ni/Sn/Cu Diffusion Couples during Aging [J] . K.K. Hong, J.B. Ryu, C.Y. Park, Journal of Electronic Materials . 2008,第1期
• 5. Layer-by-layer laser synthesis of Cu-Al-Ni intermetallic compounds and shape memory effect [J] . Volyanski I., Shishkovsky I. V., Yadroitsev I., Inorganic materials . 2016,第6期
• 6. Formation of Cu_6Sn_5/(Cu, Ni)_6Sn_5 Intermetallic Compounds between Cu_3Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding [C] . FLORA Somidin, STUART McDonald, KAZUHIRO Nogita Electronic Packaging Interconnect Technology Symposium . 2018
• 7. First-principles point defect models in Zr7Ni10 and Zr2Ni7 binary intermetallic compounds and their implications in nickel-metal hydride batteries. [D] . Wong, Diana F. 2015
• 8. Suppressed Growth of (Fe Cr Co Ni Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging [O] . Yu-An Shen, Chun-Ming Lin, Jiahui Li, -1
• 9. Shape-Controlled Conversion of b-Sn Nanocrystals into Intermetallic M-Sn (M = Fe, Co, Ni, Pd) Nanocrystals [O] . -1
• 10. Formation of the Intermetallic Compounds Between Liquid Sn Different Cu-Ni Metalization [R] . Vuorinen, V., Kohonen, T. M., Kivilahti, J. K. 2001

• 1. Electronic Structure Effect on Model Cluster for L1_2 Structure of Al_3Ti Intermetallic Compound with an Addition of Alloying Elements Fe, Ni and Cu [J] . Senying LIU ,Rongze HU ,Dongliang ZHAO and Chongyu WANG(Central Iron and Steel Research Institute Beijing 100081 China)(To whom correspondence should be addressed)Ping LUO(National Research Cent or Certified Materials Beijing 100013 China)Zhongjie P . 材料科学技术：英文版 . 1995,第5期
• 2. Synthesis of Ni/Al System Intermetallic Compound Under the Influence of Pulsating Electric Current [J] . 胡建华 . 武汉理工大学学报：材料科学英文版 . 2003,第2期
• 3. Effects of Cu addition on growth of Au-Sn intermetallic compounds at Sn-xCu/Au interface during aging process [J] . TIAN YanhongWANG Chunqingand LIU Wei Microjoining LaboratoryState Key Laboratory of Advanced Welding Production TechnologyHarbin Institute of TechnologyHarbin 15000China . 稀有金属：英文版 . 2007,第S1期
• 4. SnIn钎料与Au/Ni/Cu钎焊界面金属间化合物的研究 [C] . 赵杰 ,钟海峰 ,刘平 . 第二十一届全国钎焊及特种连接技术交流会 . 2015
• 5. Cu/Sn/Cu(Ni)结构中金属间化合物微焊点的组织演化及力学性能研究 [A] . 莫丽萍 . 2016