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Molding compound adhesion for map-molded flip-chip
Molding compound adhesion for map-molded flip-chip
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机译：映射成型倒装芯片的模塑料粘合力
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摘要
A semiconductor device whose semiconductor device components have particularly reliable adhesion to a plastic housing composition surrounding them is intended to be produced by a simplest possible method. An adhesion promoting solution is introduced into the interspace between the front side of the flip-chips and the top side of the substrate and the solvent from the adhesion promoting solution is evaporated with formation of an adhesion promoting coating on the front sides of the semiconductor chips and the top side of the substrate. The semiconductor chip and the top side of the substrate are subsequently embedded into a plastic housing composition.
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