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Photolithography method including technique of determining distribution of energy of exposure light passing through slit of exposure apparatus
Photolithography method including technique of determining distribution of energy of exposure light passing through slit of exposure apparatus
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机译:包括确定通过曝光设备的狭缝的曝光光的能量分布的技术的光刻方法
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摘要
The energy distribution of exposure light directed passing through the slit of an exposure apparatus is determined. A photoresist layer on a substrate is exposed over a plurality of shots while changing the intensity of the exposure light for each shot. Then the photoresist layer is developed to form a sample photoresist layer. An image of the developed sample photoresist layer is analyzed for color intensity. Values of the color intensity across a selected one of the shots are correlated with values of the intensity of the exposure light to produce an energy distribution of the exposure light along the length of the slit. The energy distribution is used to change the slit so that a more desirable energy distribution may be realized when the slit is used in a process of manufacturing a semiconductor device.
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