3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer

• 1. 一种有源3D眼镜的专用集成电路、控制器及有源3D眼镜 [P] . 中国专利： CN201955555U . 2011.08.31
• 2. 用于检测堆叠式集成电路装置中的层到层耦合的电路 [P] . 中国专利： CN102282672B . 2014.06.18
• 3. Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer [P] . 美国专利： US8399336B2 . 2013-03-19

  机译： 用于制造具有堆叠在低成本有源电路层之前的低成本有源电路层的3D集成电路器件的方法

• 4. 3D INTEGRATED CIRCUIT DEVICE HAVING LOWER-COST ACTIVE CIRCUITRY LAYERS STACKED BEFORE HIGHER-COST ACTIVE CIRCUITRY LAYER [P] . 美国专利： US2012299200A1 . 2012-11-29

  机译： 具有较高成本的有源电路层之前堆叠的低成本有源电路层的3D集成电路设备

• 5. 3D INTEGRATED CIRCUIT DEVICE HAVING LOWER-COST ACTIVE CIRCUITRY LAYERS STACKED BEFORE HIGHER-COST ACTIVE CIRCUITRY LAYER [P] . 美国专利： US2010314711A1 . 2010-12-16

  机译： 具有较高成本的有源电路层之前堆叠的低成本有源电路层的3D集成电路设备

• 1. Recent Advances in Constructing Interfacial Active Catalysts Based on Layered Double Hydroxides and Their Catalytic Mechanisms [J] . Haoxuan Du, Jiaxuan Fan, Chenglin Miao, 天津大学学报（英文版） . 2021,第001期
• 2. Active facet determination of layered double hydroxide for oxygen evolution reaction [J] . Yunqi Zhang, Wenfu Xie, Jialing Ma, 天然气化学（英文版） . 2021,第009期
• 3. Active facet determination of layered double hydroxide for oxygen evolution reaction [J] . Yunqi Zhang, Wenfu Xie, Jialing Ma, 能源化学：英文版 . 2021,第009期
• 4. Active corrosion protection of super-hydrophobic corrosion inhibitor intercalated Mg-Al layered double hydroxide coating on AZ31 magnesium alloy [J] . Xin Wang, Yuxin Zhang, Chuan Jing, 镁合金学报（英文） . 2020,第001期
• 5. Aneuploid neurons are functionally active and integrated into brain circuitry [J] . M. A. Kingsbury, B. Friedman, M. J. McConnell, Proceedings of the National Academy of Sciences of the United States of America . 2005,第17期
• 6. Electrical and Mechanical Properties of Through-Silicon Vias and Bonding Layers in Stacked Wafers for 3D Integrated Circuits [J] . SUNG-HWAN HWANG, BYOUNG-JOON KIM, HO-YOUNG LEE, Journal of Electronic Materials . 2012,第2期
• 7. Electrical and Mechanical Properties of Through-Silicon Vias and Bonding Layers in Stacked Wafers for 3D Integrated Circuits [J] . Sung-Hwan Hwang, Byoung-Joon Kim, Ho-Young Lee, Journal of Electronic Materials . 2012,第2期
• 8. A novel approach to deprocess highly sensitive multi-layered IC device using polyimide protective films without damaging active circuitry [C] . Yusof Nik Mohd Tajuddin, Wei Yuan Wong, Ramuhzan Fadhilah Nurani International Symposium on the Physical and Failure Analysis of Integrated Circuits . 2015
• 9. Active microdisk resonant devices and semiconductor optical equalizers as building blocks for future photonic circuitry. [D] . Djordjev, Kostadin Dimitrov. 2002
• 10. The Effect of Multi-Layer Stacking Sequence of TiOx Active Layers on the Resistive-Switching Characteristics of Memristor Devices [O] . Minho Kim, Kungsang Yoo, Seong-Pil Jeon, 2020
• 11. Highly sensitive active pixel image sensor array driven by large-area bilayer MoS2 transistor circuitry [O] . Seongin Hong, Nicolò Zagni, Sooho Choo, 2021

• 1. Combining the 8-hydroxyquinoline intercalated layered double hydroxide film and sol-gel coating for active corrosion protection of the magnesium alloy [J] . Yahya Jafari Tarzanagh ,Davod Seifzadeh ,Roghaye Samadianfard . 矿物冶金与材料学报:英文版 . 2022,第3期
• 2. 扫描电镜透过表面绝缘层透视检测半导体和集成电路及真空微电子器件的新技术 [C] . 王建 ,李亚文 ,肖玲 . 第八届中国场致发射与真空微电子学学术会议 . 2001
• 3. 双模式有源功率因数校正专用集成电路的设计 [A] . 曹辉 . 2006