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Methodologies and test configurations for testing thermal interface materials
Methodologies and test configurations for testing thermal interface materials
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机译：用于测试热界面材料的方法和测试配置
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摘要
Methodologies and test configurations are provided for testing thermal interface materials and, in particular, methodologies and test configurations are provided for testing thermal interface materials used for testing integrated circuits. A test methodology includes applying a thermal interface material on a device under test. The test methodology further includes monitoring the device under test with a plurality of temperature sensors. The test methodology further includes determining whether any of the plurality of temperature sensors increases above a steady state.
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