CMOS Image Sensor Big Via Bonding Pad Application for AICu Process

• 1. 三维硅通孔结构CMOS图像传感器及其制备方法 [P] . 中国专利： CN109273468A . 2019-01-25
• 2. 利用硅通孔接点的CMOS图像传感器晶片层级封装及其制造方法 [P] . 中国专利： CN101356645A . 2009-01-28
• 3. CMOS image sensor big via bonding pad application for AICu process [P] . 美国专利： US8680635B2 . 2014-03-25

  机译： CMOS图像传感器通过AICu工艺的大尺寸焊盘应用

• 4. CMOS image sensor big via bonding pad application for AICu process [P] . 美国专利： US8344471B2 . 2013-01-01

  机译： CMOS图像传感器通过AICu工艺的大尺寸焊盘应用

• 5. CMOS IMAGE SENSOR BIG VIA BONDING PAD APPLICATION FOR AICu PROCESS [P] . 美国专利： US2011024866A1 . 2011-02-03

  机译： CMOS图像传感器大面积粘接焊盘，用于AICu工艺

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