CHIP ARRANGEMENT, A METHOD FOR FORMING A CHIP ARRANGEMENT, A CHIP PACKAGE, A METHOD FOR FORMING A CHIP PACKAGE

• 1. 芯片布置组件及用于形成芯片布置组件的方法 [P] . 中国专利： CN103515254A . 2014-01-15
• 2. 焊料材料、层结构及其形成方法、芯片封装及其形成方法、芯片布置及其形成方法 [P] . 中国专利： CN112951786A . 2021-06-11
• 3. Solder Material, Layer Structure, Chip Package, Method of Forming a Layer Structure, Method of Forming a Chip Package, Chip Arrangement, and Method of Forming a Chip Arrangement [P] . US2021183804A1 . 2021-06-17

  机译： 焊料材料，层结构，芯片封装，形成层结构的方法，形成芯片封装的方法，芯片布置和形成芯片布置的方法

• 4. Method of Forming a Chip Arrangement, Chip Arrangement, Method of Forming a Chip Package, and Chip Package [P] . 美国专利： US2019221465A1 . 2019-07-18

  机译： 形成芯片布置的方法，芯片布置，形成芯片封装的方法和芯片封装

• 5. Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package [P] . 美国专利： US8847385B2 . 2014-09-30

  机译： 芯片布置，形成芯片布置的方法，芯片封装，形成芯片封装的方法

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