首页> 外国专利> The wire electrical discharge machining device, wire electrical discharge machining manner, sheet production manner and semiconductor wafer production manner

The wire electrical discharge machining device, wire electrical discharge machining manner, sheet production manner and semiconductor wafer production manner

机译:线材放电加工装置,线材放电加工方式,片材生产方式和半导体晶片生产方式

摘要

A wire electric discharge machining apparatus is constructed in such a manner as to include: a wire electrode having a plurality of cutting wire portions that are separated from one another in parallel and are opposed to a workpiece; a machining power supply that generates a pulsed machining voltage; a plurality of power feed contact units that are electrically connected to the cutting wire portions and apply the machining voltage between the cutting wire portions and the workpiece; and a nozzle that ejects machining liquid from an ejection opening toward an electrode gap along the cutting wire portions.
机译:金属丝放电加工装置以如下方式构成:金属丝电极具有:多个切割金属丝部分,所述多个金属切割丝部分彼此平行地分开并且与工件相对;产生脉冲加工电压的加工电源;多个馈电接触单元,其电连接至切割线部分并在切割线部分与工件之间施加加工电压。喷嘴,其沿着切割线部从喷射口向电极间隙喷射加工液。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号