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Probe implemental manner

机译：探究实施方式

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摘要

P To provide a method capable of mounting a probe easily by solving a conventional problem caused by HEAT during probe exchange. PSOLUTION: This method for holding the probe by a probe hand mechanism and mounting it ON a probe card substrate includes a process for holding a handling plate by the probe hand mechanism when mounting the probe, and removing the handling plate after mounting the probe and whereas the probe has a tip part to be in contact with a semiconductor device which is an inspection object; an arm part linking thereto; a mounting part linking to the arm part and to be mounted ON a probe card base; and further the handling plate linking to the arm part and the mounting part. PCOPYRIGHT: (C)2009 and JPO& INPIT

机译：

提供一种能够通过解决在探针更换期间由HEAT引起的传统问题而能够容易地安装探针的方法。

解决方案：这种通过探针手机构固定探针并将其安装在探针卡基板上的方法包括以下步骤：在安装探针时通过探针手机构固定处理板，并在安装探针后移去处理板。探头，并且该探头具有与作为检查对象的半导体器件接触的尖端部分;连接到其的臂部分;连接到臂部并安装在探针卡基座上的安装部;进一步，所述操纵板与所述臂部和所述安装部连接。

版权：（C）2009和JPO＆INPIT 展开▼

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公开/公告号JP5273841B2

专利类型
公开/公告日2013-08-28

原文格式PDF
申请/专利权人日本電子材料株式会社;
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申请/专利号JP20070237081
发明设计人森親臣;森隆一郎;垂水憲一;
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申请日2007-09-12
分类号G01R1/06;G01R1/067;H01L21/66;
国家 JP
入库时间 2022-08-21 16:56:31

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