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Drop impact resistance in excellent solder alloy, and solder balls with it, as well as the solder joints

机译：优异的焊锡合金，焊锡球及其焊点的抗冲击性下降

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摘要

PPROBLEM TO BE SOLVED: To provide a solder alloy, a solder ball and a soldered part which satisfy requirements for melting points and mechanical strength and also are excellent in drop impact resistance. PSOLUTION: The invented solder alloy contains 0.1-2.0 mass% Ag, 0.05-2.0 mass% Zn, and the balance being Sn and inevitable impurities and is excellent in drop impact resistance. The invented solder ball is formed by spheroidizing the solder alloy. The soldered part is formed by connecting the solder alloy and solder ball to an Ni electrode. PCOPYRIGHT: (C)2009,JPO&INPIT

机译：

要解决的问题：提供一种满足熔点和机械强度要求并具有优异的耐滴落冲击性的焊料合金，焊料球和焊接部件。

解决方案：本发明的焊料合金包含0.1-2.0质量％的Ag，0.05-2.0质量％的Zn，余量为Sn和不可避免的杂质，并且耐滴落冲击性优异。本发明的焊球是通过使焊料合金球化而形成的。通过将焊料合金和焊料球连接到Ni电极来形成焊料部分。

版权：（C）2009，日本特许厅＆INPIT 展开▼

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公开/公告号JP5322469B2

专利类型
公开/公告日2013-10-23

原文格式PDF
申请/专利权人トゥクサンハイ‐メタルシーオーエルティディ;
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申请/专利号JP20080080909
发明设计人伊達正芳;若野基樹;
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申请日2008-03-26
分类号B23K35/26;C22C13/00;H05K3/34;
国家 JP
入库时间 2022-08-21 16:57:56

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