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Device for clamping wafer utilized in e.g. micro system technology, has suction port connected with vacuum ejector via distributor, and suction insert provided in suction port and includes resilient hollow body opened at its two sides
Device for clamping wafer utilized in e.g. micro system technology, has suction port connected with vacuum ejector via distributor, and suction insert provided in suction port and includes resilient hollow body opened at its two sides
The device has a clamping table (1) with a highly planar bearing surface (1.1) for supporting a wafer. A suction port i.e. two-stage through-hole (3), is connected with a vacuum ejector via a distributor. A suction insert is provided in the suction port and includes a resilient hollow body i.e. bellows (6), opened at its two sides. An annular contact surface is formed in a part of the suction port, and a flange is provided on the contact surface. The bellows is firmly mounted on the flange. An air radiator is arranged above the clamping table.
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