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Cooling device for electronic component, has heat receiving surface connected with heat delivering surface, and heat receiving end accommodated in groove, where delivering surface lies on closed side
Cooling device for electronic component, has heat receiving surface connected with heat delivering surface, and heat receiving end accommodated in groove, where delivering surface lies on closed side
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机译：电子部件的冷却装置，其受热面与受热面连接，受热端收纳在槽内，该受热面位于封闭侧。
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摘要
The device (1) has a heat pipe (12) comprising a heat receiving end (121) and a heat delivering end (122), where the receiving end comprises a heat receiving surface (1211) and a heat delivering surface (1212). The heat receiving surface is connected with the heat delivering surface. The heat receiving end is accommodated in a groove (114) of a cooling body (11). The heat delivering surface lies on a closed side (1142), and the heat receiving surface is aligned with a surface. The cooling body is formed by a stack of cooling ribs (2). An independent claim is also included for a method for manufacturing a cooling device.
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