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SYSTEM FOR LASER CUTTING DETAILS laser beam VARIABLE SPEED CUTTING

机译:激光切割细节系统激光光束可变速度切割

摘要

FIELD: process engineering.;SUBSTANCE: invention relates to laser cutting of parts (3) at variable cutting speed (v) along cutting line (L1, L2). Proposed system comprises moving head (10) for laser beam positioning the laser beam (5) on part (3), user's interface (45) to set cutting line (L1, L2) and to set required laser beam (5) path precision (ΔB) and device (20) to control displacement of laser beam head (10) along said lines (L1, L2) in compliance with set of processing parameters (LL, DF, D0, ΔB, DS, DD, PG). First subset (G1) is composed of parameters (LL, DF, D0, ΔB, DS, DD, PG) and comprises solely one parameter (LL) or more of them (LL) that influences laser beam power available for cutting. Second subset (G2) is composed of parameters (DF, D0, ΔB, DS, DD, PG) and comprises parameters that do not influence laser beam power available for cutting. At least one parameter of said second subset can be controlled by device (20) subjected to at least one variable control parameter (S20, S21, S22, S23, S24, S25, S26, S27) subject to processing head recorded speeds (vg1, vg2).;EFFECT: uniform cut surfaces at high cutting speed.;15 cl, 10 dwg, 1 tbl
机译:技术领域本发明涉及沿切割线(L1,L2)以可变切割速度(v)对零件(3)进行激光切割。拟议的系统包括用于将激光束(5)定位在部件(3)上的激光束的移动头(10),用户界面(45)以设置切割线(L1,L2)并设置所需的激光束(5)路径精度( ΔB)和装置(20),以根据一组处理参数(LL,DF,D0,ΔB,DS,DD,PG)来控制激光束头(10)沿着所述线(L1,L2)的位移。第一子集(G1)由参数(LL,DF,D0,ΔB,DS,DD,PG)组成,并且仅包含一个或多个影响切割可用激光束功率的参数(LL)。第二子集(G2)由参数(DF,D0,ΔB,DS,DD,PG)组成,并且包含不影响可用于切割的激光束功率的参数。所述第二子集的至少一个参数可以由经受至少一个可变控制参数(S20,S21,S22,S23,S24,S25,S26,S27)的设备(20)控制,所述可变控制参数受到处理头记录的速度(vg1, vg2).;效果:以高切削速度切割均匀的表面;; 15 cl,10 dwg,1 tbl

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