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ADHESIVE CHUCK, A SUBSTRATE BONDING DEVICE USING ATTRACTION BETWEEN MOLECULES, AND A METHOD THEREOF

机译:吸附卡盘,利用分子间吸引力的基质结合装置及其方法

摘要

PURPOSE: An adhesive chuck, a substrate bonding device using the same, and a method thereof are provided to bone a substrate by van der Waals force.;CONSTITUTION: An adhesive chuck(120) is located in a chamber. The adhesive chuck includes a plurality of adhesive protrusions(124a). The adhesive protrusions are bonded each other by attraction between a substrate and molecules. A driving unit makes the substrate close to another substrate which is located in the chamber to bond the substrates each other. A plurality of separation pins penetrate the adhesive chuck to separate the substrates. A separation member is coupled with ends of the separation pins. The separation member includes a separation bar. The separation bar pressurizes the substrate in a separation direction when the substrates are separated.;COPYRIGHT KIPO 2012
机译:目的:提供一种粘合卡盘,使用该粘合卡盘的基板粘合装置及其方法,以通过范德华力对基板进行成骨。;组成:粘合卡盘(120)位于腔室内。粘性卡盘包括多个粘性突起(124a)。粘合剂突起通过基板和分子之间的吸引彼此结合。驱动单元使基板靠近位于腔室中的另一基板以使基板彼此结合。多个分离销穿透粘合剂卡盘以分离基板。分离构件与分离销的端部联接。分离构件包括分离杆。分离基板时,分离杆沿分离方向对基板加压。; COPYRIGHT KIPO 2012

著录项

  • 公开/公告号KR20120069647A

    专利类型

  • 公开/公告日2012-06-28

    原文格式PDF

  • 申请/专利权人 LIGADP CO. LTD.;

    申请/专利号KR20120060858

  • 发明设计人 SHIM SEOK HEE;CHO HYUN WOO;

    申请日2012-06-07

  • 分类号G02F1/13;G02F1/1339;

  • 国家 KR

  • 入库时间 2022-08-21 17:09:41

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