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ELECTROLESS SILVER PLATING SOLUTION INCLUDING HYDRAZINE, AN ELECTROLESS PLATING METHOD USING THE SAME, AND A SILVER COATING LAYER PREPARED BY THE SAME
ELECTROLESS SILVER PLATING SOLUTION INCLUDING HYDRAZINE, AN ELECTROLESS PLATING METHOD USING THE SAME, AND A SILVER COATING LAYER PREPARED BY THE SAME
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机译：包括肼在内的化学镀银溶液，使用该镀银溶液的化学镀方法以及用该镀膜制备的镀银层
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PURPOSE: Electroless silver plating solution including hydrazine, an electroless plating method using the same, and a silver coating layer prepared by the same are provided to effectively improve the specific resistance of a coating layer for semiconductor wiring by using silver, metal having low specific resistance.;CONSTITUTION: Electroless silver plating solution comprises silver nitrate as metallic salt, hydrazine as reductant, and ammonia solution as complexing agent. The plating solution also includes one of ethylenediamine and ethylenediaminetetraacetic acid(EDTA) as complexing agent. In the plating solution, the concentration of silver nitrate is 0.5-5 g/l, hydrazine 0.1-10 ml/l, ammonia solution 50-400 ml/l, and ethylenediamine or ethylenediaminetetraacetic acid 1.0-10 g/l.;COPYRIGHT KIPO 2012
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机译：用途：提供包括肼的化学镀银溶液，使用其的化学镀方法以及由其制备的银涂层，以通过使用银，具有低电阻率的金属有效地改善半导体布线用涂层的电阻率。组成：化学镀银溶液包括硝酸银作为金属盐，肼作为还原剂和氨溶液作为络合剂。镀液还包含乙二胺和乙二胺四乙酸（EDTA）中的一种作为络合剂。在镀液中，硝酸银的浓度为0.5-5 g / l，肼为0.1-10 ml / l，氨溶液为50-400 ml / l，乙二胺或乙二胺四乙酸为1.0-10 g / l。 2012年
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