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SUBSTRATE PROCESSING METHOD FOR DEVELOPMENT-PROCESSING AN ENTIRE SURFACE OF A WAFER TO HAVE HIGH UNIFORMITY, A COMPUTER STORAGE MEDIUM, AND A SUBSTRATE PROCESSING APPARATUS
SUBSTRATE PROCESSING METHOD FOR DEVELOPMENT-PROCESSING AN ENTIRE SURFACE OF A WAFER TO HAVE HIGH UNIFORMITY, A COMPUTER STORAGE MEDIUM, AND A SUBSTRATE PROCESSING APPARATUS
PURPOSE: A substrate processing method, a computer storage medium, and a substrate processing apparatus are provided to reduce defects on a surface of a substrate by eliminating bubbles generated between the substrate and surface treatment solution when the surface treatment solution is supplied on the substrate.;CONSTITUTION: Surface treatment solution is provided to one spot of a peripheral area of a substrate(W) from a nozzle(40). The liquid pool(Pa) of the surface treatment solution is formed. The nozzle moves from a peripheral area of the substrate to a central portion of the substrate by continuously supplying the surface treatment solution. The liquid pool formed in the peripheral area of the substrate moves to the central portion of the substrate. The surface treatment solution is pure water(P).;COPYRIGHT KIPO 2012
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