首页> 外国专利> ALLOY OF TUNGSTEN(W) AND COPPER(CU) HAVING FUNCTIONALLY GRADED MATERIAL(FGM) LAYERS, METAL MATERIAL HAVING THE SAME AND MANUFACTURING METHOD FOR ALLOY OF W AND CU FOR RELIABILITY OF HEAT CONDUCTIVITY

ALLOY OF TUNGSTEN(W) AND COPPER(CU) HAVING FUNCTIONALLY GRADED MATERIAL(FGM) LAYERS, METAL MATERIAL HAVING THE SAME AND MANUFACTURING METHOD FOR ALLOY OF W AND CU FOR RELIABILITY OF HEAT CONDUCTIVITY

机译：具有功能梯度材料（FGM）层的钨（W）和铜（Cu）合金，具有相同导热性的钨和铜合金的金属材料及其制造方法

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PURPOSE: Alloy of tungsten(W) and copper(Cu) having functionally graded material(FGM) layers, metal material having the same and manufacturing method for alloy of W and Cu is provided to alleviate residual heat stress by using tungsten - copper alloy.;CONSTITUTION: Tungsten - copper alloy(130) is made of tungsten and copper. A plurality of layers(131,132,133) has a different composition ratio of copper and tungsten. Copper powder coated with tungsten is sintered in which the tungsten is laminated according to the content of tungsten. The content of tungsten diminishes or increases successively.;COPYRIGHT KIPO 2012

机译：目的：提供具有功能梯度材料（FGM）层的钨（W）和铜（Cu）合金，具有相同功能的金属材料以及W和Cu合金的制造方法，以通过使用钨-铜合金减轻残余的热应力。 ;组成：钨铜合金（130）由钨和铜制成。多层（131，132，133）具有不同的铜和钨组成比。烧结涂覆有钨的铜粉，其中根据钨的含量层压钨。钨含量逐渐减少或增加。; COPYRIGHT KIPO 2012

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公开/公告号KR20120037625A

专利类型
公开/公告日2012-04-20

原文格式PDF
申请/专利权人 AGENCY FOR DEFENSE DEVELOPMENT;
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申请/专利号KR20100099194
发明设计人 NOH JOON WOONG;LEE SEONG;
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申请日2010-10-12
分类号C22C27/04;C22C1/04;
国家 KR
入库时间 2022-08-21 17:10:16

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