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MANUFACTURING AWARE DESIGN AND DESIGN AWARE MANUFACTURING

机译:制造注意事项设计和设计注意事项

摘要

Some embodiments of the invention provide a manufacturing aware process for designing an integrated circuit (IC) layout. The process receives a manufacturing configuration that specifies a set of manufacturing settings for a set of machines to be used to manufacture an IC based on the IC layout. The process defines a set of design rules based on the specified manufacturing configuration. The process uses the set of design rules to design the IC layout. Some embodiments of the invention provide a design aware process for manufacturing an integrated circuit (IC). The process receives an IC design with an associated set of design properties. The process specifies a manufacturing configuration that specifies a set of manufacturing settings for a set of machines to be used to manufacture the IC, where the specified set of manufacturing settings are based on the set of design properties. The process manufactures the IC based on the manufacturing settings.
机译:本发明的一些实施例提供了一种用于设计集成电路(IC)布局的制造意识的过程。该过程接收制造配置,该制造配置基于IC布局为用于制造IC的一组机器指定一组制造设置。该过程基于指定的制造配置定义了一组设计规则。该过程使用一组设计规则来设计IC布局。本发明的一些实施例提供了用于制造集成电路(IC)的设计意识的过程。该过程将接收具有相关设计属性集的IC设计。该过程指定制造配置,该制造配置为要用于制造IC的一组机器指定一组制造设置,其中指定的一组制造设置基于该组设计属性。该过程根据制造设置来制造IC。

著录项

  • 公开/公告号EP1889195A4

    专利类型

  • 公开/公告日2012-09-12

    原文格式PDF

  • 申请/专利权人 CADENCE DESING SYSTEMS INC.;

    申请/专利号EP20060760235

  • 发明设计人 SCHEFFER LOUIS K.;FUJIMURA AKIRA;

    申请日2006-05-20

  • 分类号G06F17/50;G03F7/20;G06F19;H01L21;

  • 国家 EP

  • 入库时间 2022-08-21 17:17:19

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