首页> 外国专利> Modular structure of electrical interconnections, the manufacturing process of modular structure of electrical interconnections, circuit board eletru00c8nico based on modular structures for electrical interconnection and assembly process of circuit board based on structures eletru00c8nico modula Res of electrical interconnections.

Modular structure of electrical interconnections, the manufacturing process of modular structure of electrical interconnections, circuit board eletru00c8nico based on modular structures for electrical interconnection and assembly process of circuit board based on structures eletru00c8nico modula Res of electrical interconnections.

机译:电气互连的模块化结构,电气互连的模块化结构的制造过程,基于电气互连的模块化结构的电路板电气以及基于电气互连的结构模块化的电路板的组装过程。

摘要

Modular structure of electrical interconnections, the manufacturing process of modular structure of electrical interconnections, circuit board eletru00c8nico based on modular structures for electrical interconnection and assembly process of the electronic circuit board based on modular structures. Es of electrical interconnections.Presents, as the first object, a modular structure of electrical interconnections; this modular structure is functionally analogous to a printed circuit board layers, i.e., the modular structure of the electrical interconnection has the basic function of supporting physically Electronic components of a circuit.In addition to allowing the electrical conductance between the terminals of the same for both, the modular structure is dealt with here is composed of blades interleaved modular, allowing a simple assembly, economic and revolutionary, stressing that the components need not be welded C Om conventional alloys welding, as second object.It is introduced the manufacture process of modular structure of electrical interconnections, and this process based on clear and functional stages, which result in the manufacture of modular structure above; as the third object, is revealed a plate of electronic circuit based on estrutu Ras modular electrical interconnections, this plate is, in fact,The junction of the electronic components with one or more modular electrical interconnection structures; and as the fourth and final object, described the process of assembly of the plates of electronic circuit based on modular structures for electrical interconnections, a process which results in a Electronic circuit boards ready for use.
机译:电互连的模块化结构,电互连的模块化结构的制造过程,基于模块化结构的电路板电连接以及基于模块化结构的电子电路板的组装过程。电气互连的E.第一个对象是电气互连的模块化结构;此模块化结构在功能上类似于印刷电路板层,即,电气互连的模块化结构具有基本功能,可物理地支撑电路的电子组件。除了允许两者的端子之间的电导,这里处理的模块化结构是由刀片交错的模块化组成,允许简单的组装,经济和革命性的,强调了不需要焊接组件的传统合金焊接,第二个目的。介绍了模块化的制造过程电气互连的结构,并且此过程基于明确的功能阶段,因此可以制造上述模块化结构;作为第三个目的,揭示了一种基于estrutu Ras模块化电气互连的电子电路板,实际上,该板是电子组件与一个或多个模块化电气互连结构的连接。并且作为第四个也是最后一个目的,描述了基于用于电气互连的模块化结构的电子电路板的组装过程,该过程导致电子电路板准备就绪。

著录项

  • 公开/公告号BRPI0800889B1

    专利类型

  • 公开/公告日2012-06-26

    原文格式PDF

  • 申请/专利权人

    申请/专利号BR2008PI00889

  • 申请日2008-03-04

  • 分类号H05K1/02;H01R12/51;H05K3;

  • 国家 BR

  • 入库时间 2022-08-21 17:25:24

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