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Method for fabricating metallized ceramics substrate, metallized ceramics substrate fabricated by the method, and package
Method for fabricating metallized ceramics substrate, metallized ceramics substrate fabricated by the method, and package
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机译：金属化陶瓷基板的制造方法，通过该方法制造的金属化陶瓷基板以及封装
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摘要
A fabrication method for metallized a ceramics substrate including the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive paste layer. The surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers.
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