首页> 外国专利> STRUCTURE FOR MINIMIZING DETERIORATION OF THERMAL AND MECHANICAL PROPERTIES OF ELECTRICAL COMPONENTS DUE TO ELEVATED TEMPERATURES

STRUCTURE FOR MINIMIZING DETERIORATION OF THERMAL AND MECHANICAL PROPERTIES OF ELECTRICAL COMPONENTS DUE TO ELEVATED TEMPERATURES

机译:由于温度升高而使电气元件的热机械性能最小化的结构

摘要

A structure including: a first part including an electrode pad in a predetermined area on a surface; a second part that is bonded to the first part using an adhesive; and a board, including a terminal pad, to which the second part is fixed, wherein the electrode pad and the terminal pad are ultrasonic-bonded, and the second part includes bosses on an area that overlaps the predetermined area in a bonding surface between the second part and the first part.
机译:一种结构,包括:第一部分,其在表面上的预定区域中包括电极焊盘;使用粘合剂将第二部分粘结到第一部分上;基板,其包括固定有第二部分的端子焊盘,其中,电极焊盘和端子焊盘被超声接合,并且第二部分在与基板之间的接合表面中与预定区域重叠的区域上包括凸台。第二部分和第一部分。

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